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PCB Frequently Asked Questions
PCB FAQs: Your One-Stop Resource for Everything from Design to Production
Looking for reliable information on PCB fabrication, PCB assembly, and China PCB manufacturing? Look no further than our comprehensive FAQs page. Our expert answers cover everything from the types of PCB materials to the latest industry trends, helping you stay informed and make informed decisions. Whether you're a PCB designer, engineer, or manufacturer, our FAQs will provide you with the key insights and knowledge you need to succeed in today's dynamic market.
01.
General Questions
JHYPCB is a PCB manufacturer and assembly service provider based in China. We offer services like PCB prototype, PCB production, PCB assembly, component sourcing, and a range of other custom PCB services. We cater to a global clientele and have experience working with a diverse range of industries, including telecommunications, consumer electronics, medical equipment, aerospace, automotive, and more. JHYPCB is known for their quality PCB products, competitive pricing, and fast delivery times.
JHYPCB is a professional PCB manufacturer based in China. They produce all circuit boards in China and ship them directly to your office, ensuring efficient and reliable delivery of high-quality PCB products.
Over the past 12 years, JHYPCB has shipped PCB boards to customers from more than 80 countries around the world, and this number continues to grow year after year. Therefore, you can be confident that JHYPCB can ship boards to your country, no matter where you are located.
Over the past 12 years, JHYPCB has shipped PCB boards to customers from more than 80 countries around the world, and this number continues to grow year after year. Therefore, you can be confident that JHYPCB can ship boards to your country, no matter where you are located.
We offer 24/7 round-the-clock service, available to assist and support customers at any time. Whenever customers need our help, we will do our best to provide the best service.
The purpose of a PCB is to provide a compact and organized way to connect various electronic components within a circuit.
The different layers of a PCB typically include the copper layer, prepreg layer, and substrate layer.
A single-sided PCB has components on only one side, while a double-sided PCB has components on both sides.
A multi-layer PCB has several layers of copper sandwiched between layers of insulating material.
A Gerber file is a standard file format used in the PCB fabrication process to specify the layout of copper layers, solder mask, and other details.
ODB++ is an industry-standard file format used in the PCB fabrication process to provide a more comprehensive set of design files than just Gerber files.
Eagle is a popular PCB design software that can generate design files for the PCB fabrication process.
A PCB is a permanent component of an electronic device, while a breadboard is a temporary platform for testing and prototyping circuits.
A flex PCB is a flexible PCB that can be flexed or bent to fit into tight spaces.
A rigid-flex PCB is a combination of a flex PCB and a rigid PCB that provides a more flexible and compact design.
A bare PCB is just the circuit board without any components attached, while an assembled PCB has all of the necessary components attached to it.
A prototype PCB is used for testing and validation of a new design, while a production PCB is the final version of the design that will be manufactured on a large scale.
RoHS is a set of regulations that restrict the use of certain hazardous substances in electronic products.
The purpose of RoHS is to reduce the environmental impact of electronic products by limiting the use of hazardous substances in their production.
UL certification is a safety certification issued by Underwriters Laboratories for electronic products.
The purpose of UL certification is to ensure that electronic products meet specific safety criteria and comply with relevant standards.
02.
PCB Material FAQs
PCB material is a substrate used to build printed circuit boards.
FR-4 is a flame-retardant material used in PCB manufacturing. It is a composite material made of woven fiberglass cloth and epoxy resin binder.
The thermal conductivity of FR-4 material is low, typically between 0.2-0.5 W/mK.
The glass transition temperature of FR-4 material is around 135-140°C.
Polyimide is a high-temperature-resistant material used in PCB manufacturing. It has excellent electrical, mechanical, and thermal properties.
The glass transition temperature of Polyimide material is around 260-350°C.
Tg stands for glass transition temperature, which is the temperature at which a PCB material changes from a solid to a liquid state.
The dielectric constant (Dk) of a PCB material is a measure of the material’s ability to store electrical energy.
Epoxy is a type of resin used as a bonding agent in PCB production.
The maximum operating temperature of an Epoxy PCB material is around 120-130°C.
Rogers PCB material is a high-frequency substrate used in PCB manufacturing. It has excellent dielectric properties.
There are various types of Rogers PCB materials, including Rogers RO4350B, RO4003C, RO3003, and RO5880.
Yes, a Rogers PCB can be bent according to the manufacturer’s instructions.
The glass transition temperature of Rogers PCB materials varies depending on the type of material used.
The thermal coefficient of expansion (TCE) of a PCB material is a measure of the material’s ability to expand or contract with temperature changes.
High Tg FR-4 has a higher glass transition temperature than standard FR-4, making it more suitable for high-temperature applications.
The dielectric breakdown strength of a PCB material is the measure of the voltage that can cause the material to break down and fail.
The dielectric loss (Df) of a PCB material is the measure of the energy lost as the signal travels through the material.
The Coefficient of Thermal Expansion (CTE) of a PCB material is the measure of the material’s expansion or contraction as temperature changes.
The breakdown voltage of a PCB material is the measure of the voltage at which the material will break down and fail.
The tensile strength of a PCB material is the measure of the maximum force that can be applied to it before it will fracture.
The flexural strength of a PCB material is the measure of the maximum flexural stress that it can withstand without breaking.
The degradation temperature of a PCB material is the temperature at which the material will begin to break down and degrade.
The moisture absorption of a PCB material is the measure of the amount of moisture it can absorb.
PCB materials can be recycled to some extent, but the process is complicated and expensive.
The shelf life of a PCB material is the maximum time it can be stored before it degrades or becomes unusable.
The dielectric strength of a PCB material is the measure of the voltage that it can withstand before it breaks down and fails.
The thermal conductivity of a PCB material is the measure of its ability to conduct heat.
The thermal resistance of a PCB material is the measure of its ability to resist the flow of heat.
The peel strength of a PCB material is the measure of its ability to resist peeling or delamination.
The CAF resistance of a PCB material is the measure of its ability to resist conductive anodic filament formation.
The moisture resistance of a PCB material is the measure of its ability to resist moisture absorption.
The chemical resistance of a PCB material is the measure of its ability to resist chemical attack.
The electrical resistivity of a PCB material is the measure of its ability to conduct or resist electrical current.
The breakdown strength of a PCB material is the measure of the voltage at which it will break down and fail.
The outgassing of a PCB material is the measure of the amount of gas or vapor released when it is exposed to a vacuum.
The service temperature range of a PCB material is the temperature range in which it can operate without degrading or failing.
A leaded PCB material contains lead, while a lead-free PCB material does not.
The thermal expansion coefficient (TEC) of a PCB material is the measure of how much it will expand or contract with temperature changes.
The dissipation factor (Df) of a PCB material is the ratio of the energy lost to the energy stored as it travels through the material.
The thickness of a PCB material can vary, depending on the manufacturer and the material used.
The weight of a PCB material can vary, depending on the manufacturer and the material used.
The maximum operating frequency of a PCB material depends on its dielectric constant and loss tangent.
The moisture sensitivity level (MSL) of a PCB material is the measure of its susceptibility to moisture-related failures.
For high frequency circuits, materials with low dielectric constant and loss factor, such as Teflon, are needed.
No. Different types of PCB materials have different performance characteristics, and excessive thickness or thinness can lead to performance issues. The appropriate type of PCB material should be selected based on specific requirements.
The copper foil layer is mainly used for conducting electricity on the PCB and connecting circuits.
The copper-clad layer is a layer of copper foil plated on one or both sides of the PCB substrate. Its main purpose is to provide a conductive layer for the PCB in order to connect circuits and provide a ground plane.
FR-4 is the most commonly used PCB material, and its advantages include good chemical stability, insulation, mechanical strength, and material stability.
The thickness of the copper foil can affect the conductivity and signal transmission rate of the PCB, so selecting the appropriate thickness is important.
The thermal stability of PCB materials refers to the ability of the material to maintain its shape and resist melting or deformation under high temperature conditions. Thus, PCB materials with good thermal stability can improve the stability and lifespan of the PCB.
For high frequency circuit design, it is recommended to use high frequency PCB materials, such as RF-35 and PTFE, as these materials have better performance and lower losses in high frequency circuits.
The PCB substrate material can affect multiple performance indicators such as thermal stability, dielectric constant, mechanical strength, etc. Therefore, it is necessary to choose the appropriate substrate material based on specific requirements.
The thickness of the PCB material directly affects performance parameters such as dielectric constant, thermal resistance, mechanical strength, etc. Therefore, the appropriate thickness should be chosen during the PCB design process.
03.
PCB Fabrication FAQs
PCB fabrication is the process of creating a printed circuit board using copper and other materials to create a specific circuit design.
Materials used in the PCB fabrication process include copper, fiberglass, and epoxy resin.
The cost of PCB fabrication can vary depending on the level of complexity and the size of the board. At JHYPCB, we provide PCB manufacturing services with the best cost-effectiveness.
The minimum order quantity for PCB fabrication can vary depending on the manufacturer. At JHYPCB, we have no MOQ requirement.
The PCB fabrication process can take anywhere from a few days to a few weeks, depending on the complexity of the board. At JHYPCB, we offer quick-turn PCB fabrication service for customers’ urgent projects.
PCB design files can be provided to the manufacturer in various formats, including Gerber files, ODB++ files, or Eagle files.
The minimum trace width and spacing for PCB fabrication can vary depending on the manufacturer and the requirements of the specific design. At JHYPCB, we can manufacture a minimum 3il trace width and spacing PCB.
Panelization is the process of arranging multiple PCB designs on a single board to make the most efficient use of space and materials.
Solder mask is used in PCB fabrication to protect and insulate the copper traces and pads on the PCB.
The silkscreen is used in PCB fabrication to provide a clear and legible indication of component placement, part numbers, and other important details.
Electrical testing is used in PCB fabrication to verify the integrity of the circuit and ensure that all components are connected correctly.
A via is used in PCB fabrication to connect different layers of copper in a circuit.
The minimum size of a via can vary depending on the manufacturer and the requirements of the specific design.
A blind via extends only to a specific depth in the PCB, rather than going through the entire board.
A buried via is located between the layers of the PCB, rather than extending to the surface.
The minimum drill size in PCB fabrication can vary depending on the manufacturer and the requirements of the specific design.
Copper fill is used in PCB fabrication to provide additional conductivity and reduce the overall impedance of the circuit.
Impedance control is used in PCB fabrication to ensure that the impedance of the circuit is consistent throughout the board.
Conformal coating is used in PCB fabrication to protect the board from moisture, dust, and other environmental factors.
A thermal pad is used in PCB fabrication to provide a conductive path for heat to be dissipated away from a component.
04.
PCB Assembly FAQs
PCB assembly is the process of placing components onto a printed circuit board in the correct locations and soldering them into place.
For our Prototype service, the minimum order quantity of PCBs is 5 pieces, but it is acceptable to order only one assembled board.
Yes, we offer turnkey PCB assembly service at JYHPCB. This means that we can handle every step of the process, from PCB fabrication to component purchasing and assembly. Our turnkey service can save you time and effort, as we take care of all aspects of the assembly process. We have experience with a wide range of industries, including medical, automotive, and consumer electronics, and we have the capabilities to handle both small and large-scale projects. If you’re interested in our turnkey PCB assembly service, please don’t hesitate to contact us for more information.
Surface mount technology (SMT) is a method for attaching electronic components to a printed circuit board. SMT components are smaller and lighter than their through-hole counterparts.
Through-hole technology (THT) is a method for attaching electronic components to a printed circuit board by inserting the leads through holes in the board and soldering them on the other side.
A pick and place machine is a machine that picks up individual SMT components from a reel or tray and places them onto the PCB in their correct locations.
A stencil is a metal or plastic plate with holes cut out in the shape of the pads on the PCB, used for applying solder paste to the board.
Reflow soldering is a process for melting solder onto the pads and leads of SMT components by heating the entire board in an oven.
Wave soldering is a process for soldering THT components onto a PCB by running the board over a wave of molten solder.
Selective soldering is a process for soldering THT components onto a PCB using a machine that only applies solder to specific areas of the board.
Conformal coating is a protective coating applied to a PCB to prevent moisture, dust, and other contaminants from damaging the components.
A BOM (bill of materials) is a list of all the components needed for a PCB assembly.
A pick and place file contains information about the location and orientation of components on a PCB, used by the pick and place machine to place the components onto the board.
An XY file contains information about the location of holes, pads, and other features on a PCB, used by the drilling machine to drill the PCB.
ESD (electrostatic discharge) is a sudden electrical discharge that can damage electronic components. Proper ESD protection is necessary when handling sensitive components.
A bed of nails test is a type of PCB test where a test fixture with numerous spring-loaded pins is used to access the electrical connections on a PCB.
A rework station is a machine used to remove and replace components on a PCB if they are found to be defective during testing.
A conformal coating thickness tester is a machine used to ensure that the conformal coating on a PCB is of the correct thickness and has no voids.
A desoldering pump is a tool used to remove excess solder from a PCB or component by creating a vacuum and pulling the solder away.
A hot air rework station is a machine used to remove and replace components on a PCB by directing heated air onto the component to melt the solder.
Selective conformal coating is a process for applying conformal coating only to certain areas of the PCB.
A conformal coating curing oven is an oven that is used to cure the conformal coating on a PCB by subjecting it to heat.
A wave soldering machine is a machine used to solder THT components onto a PCB by running the board over a wave of molten solder.
Selective conformal coating masking is the process of using a mask to protect certain areas of a PCB from conformal coating during the coating process.
A pick and place feeder is a machine that holds a reel of SMT components and feeds them to the pick and place machine as needed.
A solder paste stencil printer is a machine used to apply solder paste to a PCB by using a stencil and a squeegee.
A solder paste inspection machine is a machine used to inspect the application of solder paste to a PCB to ensure that it is applied evenly and without voids.
A reflow oven profile is a set of parameters used to control the temperature and heating cycle of a reflow oven during the soldering process.
A wave soldering profile is a set of parameters used to control the speed and temperature of the wave of molten solder during the wave soldering process.
A PCB wash machine is a machine used to clean a PCB after it has been assembled to remove any excess solder flux or other contaminants.
A pick and place accuracy rating is a measure of how accurately the pick and place machine can place components onto a PCB.
A BGA component is an SMT component with a large number of small solder balls located on the underside, used for connecting the component to the PCB.
Reflow profiling is the process of creating a reflow oven profile that is tailored to the specific components and PCB layout being assembled.
Selective soldering masking is the process of using a mask to protect certain areas of a PCB from selective soldering during the assembly process.
A wave soldering fluxer is a machine used to apply flux to a PCB before it is run through the wave of molten solder during the wave soldering process.
A manual component placement machine is a machine used to place SMT components onto a PCB by hand.
A wave soldering preheater is a machine used to preheat a PCB before it is run through the wave of molten solder during the wave soldering process.
A selective soldering nozzle is a nozzle used by a selective soldering machine to apply solder to specific areas of a PCB.
An automatic optical inspection machine is a machine used to inspect a PCB after it has been assembled to check for defects such as missing components or misplaced solder.
Need Help?
At JHYPCB, we offer 24/7 service, so you can always get in touch with us by sending an email to sales@pcbjhy.com.
- +86 138 2527 4100
